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Process Control Deals with Big Data, Busy Engineers
By Dave Lammers, Contributing Editor Turning data into insights that will improve fab productivity is one of the semiconductor industry’s biggest opportunities, one that experts say requires a...
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Innovations at 7nm to Keep Moore’s Law Alive
By Dave Lammers, Contributing Editor Despite fears that Moore’s Law improvements are imperiled, the innovations set to come in at the 7nm node this year and next may disprove the naysayers. EUV...
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Vital Control in Fab Materials Supply-Chains – Part 2
By Ed Korczynski, Sr. Technical Editor As detailed in Part 1 of this article published last month by SemiMD, the inaugural Critical Materials Council (CMC) Conference happened May 5-6 in Hillsboro,...
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Deep Learning Could Boost Yields, Increase Revenues
By Dave Lammers, Contributing Editor While it is still early days for deep-learning techniques, the semiconductor industry may benefit from the advances in neural networks, according to analysts and...
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Lithographic Stochastic Limits on Resolution
By Ed Korczynski, Sr. Technical Editor The physical and economic limits of Moore’s Law are being approached as the commercial IC fab industry continues reducing device features to the atomic-scale....
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Enabling the A.I. Era
By Pete Singer, Editor-in-Chief There’s a strongly held belief now that the way in which semiconductors will be designed and manufactured in the future will be largely determined by a variety of...
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Logic Densities Advance at IEDM 2017
By Dave Lammers The 63rd International Electron Devices Meeting brought an optimistic slant to transistor density scaling. While some critics have declared the death of Moore’s Law, there was little...
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Companies Ready Cobalt for MOL, Gate Fill
By Dave Lammers Cobalt for middle-of-the-line and trench contacts emerged at the International Electron Devices Meeting, as Intel, GlobalFoundries, and Applied Materials discussed how to best take...
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Applied Materials Fields Cobalt Solution for MOL
By Pete Singer, Editor-in-Chief Applied Materials has introduced a set of processes that enable cobalt to be used instead of tungsten and copper for contacts and middle-of-line interconnects. Higher...
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Emerging Memory Types Headed for Volumes
By David Lammers After decades of R&D, two emerging memory types – the phase change memory-based 3D Xpoint, co-developed by Intel and Micron, and the embedded spin-torque transfer magnetic RAM...
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