Wrap-up: SEMI’s Strategic Materials Conference
SEMI’s Strategic Materials Conference was held September 30-October 1, 2014, in Santa Clara, CA at the Biltmore hotel. By Karey Holland, Techcet Group The 2014 Strategic Materials Conference was very...
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Air-gaps in Copper Interconnects for Logic
By Ed Korczynski, Sr. Technical Editor, SST/SemiMD The good people at ChipWorks have released some of the first public data on Intel’s new 14nm-node process, and the results indicate that materials...
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3D ASIP: “It’s Complicated”
By Jeff Dorsch, Contributing Editor The presentations at this week’s 3D Architectures in Semiconductor Integration and Packaging conference could be summed up in a famous Facebook status: “It’s...
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IEDM: Thanks for MEMS-ories
By Jeff Dorsch, Contributing Editor At the 60th annual International Electron Devices Meeting this week in San Francisco, there was much buzz about the 14-nanometer FinFET papers being presented by...
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Solid Doping for Bulk FinFETs
By Ed Korczynski, Sr. Technical Editor In another example of the old one-liner that “all that is old is new again,” the old technique of solid-source doping is being used by Intel for a critical...
View ArticleBlog review January 26, 2015
Scott McGregor, President and CEO of Broadcom, sees some major changes for the semiconductor industry moving forward, brought about by rising design and manufacturing costs. Speaking at the SEMI...
View ArticleProponents of EUV, immersion lithography face off at SPIE
By Jeff Dorsch, contributing editor The two main camps in optical lithography are arrayed for battle at the SPIE Advanced Lithography Symposium in San Jose, Calif. Extreme-ultraviolet lithography, on...
View ArticleSolid State Watch: March 20-26, 2015
Top 20 MEMS ranking revealed; Micron and Intel announce availability of their 3D NAND technology; GlobalFoundries and NXP Semiconductor develop a 40nm eNVM low-power process technology; SEMI releases...
View ArticleSolid State Watch: May 1-8, 2015
First quarter semiconductor sales up 6% compared to last year; New study suggests that rapid innovation in semiconductors provides hope for better economic times ahead; Microchip and GlobalFoundries...
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Intel CEO looks to 3D tech at display conference
By Jeff Dorsch, Contributing Editor Intel CEO Brian Krzanich touted the capabilities of his company’s RealSense technology in a keynote address today at the Society for Information Display conference...
View ArticleSolid State Watch: July 31-August 6, 2015
Worldwide sales of semiconductors reach $84B in second quarter of 2015; Toshiba announces world's first 16-die stacked NAND flash memory with TSV tech; Intel and Micron unveil 3D XPoint memory...
View ArticleSolid State Technology: August 7-14, 2015
New research could enhance LEDs and displays; Intel to collaborate with Georgia Tech; imec extends its GaN R&D program; Strong silicon wafer area shipment growth reported in second quarter of 2015
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IoT Security, Software Are Highlighted at ARM TechCon
By Jeff Dorsch, Contributing Editor Many people are aware of the Internet of Things concept. What they want to know now is how to secure the IoT and how to develop code for it. Plenty of vendors on...
View ArticleWally Rhines of Mentor Graphics Gets Phil Kaufman Award
By Jeff Dorsch, Contributing Editor There was a celebrity roast on 4th Street in San Jose, Calif., on Thursday night. The occasion was the presentation of the annual Phil Kaufman Award to Wally Rhines,...
View ArticleInvenSense Developers Conference Tackles Sensor Security, New Technologies
By Jeff Dorsch, Contributing Editor The second day of the InvenSense Developers Conference saw presenters get down to cases – use cases for sensors. There were track sessions devoted to mobile...
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Intel Posts Mixed Results for Q4, 2015
By Jeff Dorsch, Contributing Editor Intel reported net income of $11.4 billion on revenue of $55.4 billion for the year ended December 26, compared with net of $11.7 billion on revenue of $55.9...
View ArticleWhat’s the Next-Gen Litho Tech? Maybe All of Them
By Jeff Dorsch, Contributing Editor The annual SPIE Advanced Lithography symposium in San Jose, Calif., hasn’t offered a clear winner in the next-generation lithography race. It’s becoming clearer,...
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Many Mixes to Match Litho Apps
By Ed Korczynski, Sr. Technical Editor “Mix and Match” has long been a mantra for lithographers in the deep-sub-wavelength era of IC device manufacturing. In general, forming patterns with resolution...
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EUV Resists and Stochastic Processes
By Ed Korczynski, Sr. Technical Editor In an exclusive interview with Solid State Technology during SPIE-AL this year, imec Advanced Patterning Department Director Greg McIntyre said, “The big...
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Intel Q1 Revenue, Profit Rise; Chipmaker Will Cut Up to 12,000 Jobs
By Jeff Dorsch, Contributing Editor Intel reported net income of $2.0 billion in the first quarter, up 3 percent from a year earlier, while revenue rose 7 percent to $13.7 billion, compared with $12.8...
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